Specifications

frame-ks

Process :
● Adapt to M2 (156.75), M4 (161.75), G1 (158.75), M6 (166), M10 (182), M12 (210) and 230mm silicon wafers
● Compatible to different brands of wafer texuring and PSG removal equipment

Features :
● Input: Cassette or Stack
● Output: kinds of cassette
● Optional high-precision weighing, cracking, size, fragment detection
● Optional match 5,6,8, 10 lanes
● Optional support MES interface and remote debug function OEE statistics & Energy consumption analysis
● Optional smart IGV interface

PDF Download